HPC logo

Application Guidelines

Mid-Career Course JFY 2018

Applications closed
The Mid-Career Course provides 7-day training for those who have about 10 years of work experience in fields related to peacebuilding and/or development, in order to further advance their professional careers in such fields.

Duration: Saturday, January 5, 2019 – Friday, January 11, 2019
Venue: Tokyo

Participation Fee: No fees charged for selected participants

Application Deadline: Wednesday, October 10, 2018 (9:00 AM Japan Time)

* If you don’t receive a confirmation email from HPC within a few days of your submission, please contact HPC by phone or email. (Kindly refer to the contact information on the website)

Application Guidelines(PDF)|  Course Overview(PDF) |  Application Form(Word)

The Primary Course JFY 2018

Applications closed
The Primary Course provides approximately five weeks of practical Coursework in Japan for people who have the strong will to build their careers in the field of peacebuilding and development, and to acquire the required practical knowledge and skills.
This course expects to host 15 participants from Japan and 10 participants from other countries.

Duration: Tuesday, January 22, 2019 – Friday, February 22, 2019.
*Monday, February 25-Tuesday, February 26 is optional.

Venue: Tokyo and Hiroshima City.

Participation Fee: No fees are charged for selected participants (including travel costs, travel insurance, accommodation costs, and approved living expenses)

Application Deadline: Friday, November 9, 2018 (9:00 am Japan Time)
The designated 10 countries, from which applications are accepted for the JFY2018 Primary Course.
Those from the following countries are eligible to apply for this year’s program: Afghanistan, Cameroon, Colombia, Kenya, Myanmar, Palestine, Papua New Guinea, Philippines, South Sudan, Tajikistan.

* If you don’t receive a confirmation email from HPC within a few days of your submission, please contact HPC by phone or email. (Kindly refer to the contact information on the website)

Application Guidelines(PDF)|  Course Overview(PDF) |  Application Form(Word) |  Covenant(PDF)

Top